Octavia 3D AXI-VX2000 is suitable for online non-destructive testing of SMT, DIP, and semiconductor IGBT, covering BGA/LGA/CSPSOP/OFP/QFN, transistors, R/C chips, bottom electrode components, power modules, POP, connectors, Inspection of THT insertion components, semiconductor IGBT welding layers and other packaging types.
Features:
High-speed flying shooting mode, the detection speed can reach up to 3 seconds/FOV
Multi-layer slicing detection technology, can cut up to 300 layers
The number and resolution of projections can be flexibly set to meet the needs of different scenarios.
XY, YZ, XZ three-view function enables more intuitive diagnosis of defects
Dual-drive linear motors are equipped with grating rulers to achieve high-precision positioning.
Detection principle:
High-speed flying photography and a 360° circular method are used to collect projection images, and three-dimensional reconstruction is carried out through a rapid analysis method, and then arbitrary faults are extracted for defect detection.
Technical advantages:
360° circular CT reconstruction technology
CT reconstruction technology using high-speed flying photography and 360° circular scanning is used to obtain complete volume data of the object to be detected, thereby enabling slice detection in any direction and multi-layer slice detection technology.
3D-CT image analysis function (optional)
Through the three-dimensional images generated by the 3D-CT image analysis function, more intuitive and high-precision defect diagnosis can be performed.
Flexible programming
The number of projection images and resolution can be flexibly set to meet the needs of different scenes.
Three view function
The three-view function with three slice directions improves the detection rate and helps maintenance station operators to diagnose defects more intuitively.
radiation safety
The “Basic Standards for Ionizing Radiation Protection and Radiation Source Safety” stipulates that the safety limit of radiation dose for workers is 20mSv/year.
The radiation leakage of VX2000 is <0.5μSv/h, which is about 0.18mSv/year, which is less than 1% of the national standard.
| Device Model | VX2000 | |
| imaging system | CT image reconstruction method | High-speed flying + 360° circular CT reconstruction technology |
| resolution | 6μm, 8μm, 10um, 15μm, 20um, 25μm, 30um | |
| Number of projections for CT reconstruction | 32 photos, 64 photos, 128 photos, 256 photos, 512 photos, 1024 photos | |
| X-ray source | Hamamatsu Microfocus Ray Source | |
| X-ray tube voltage and current | 30-130KV, 10-300uA | |
| X-ray receiving device | CMOS flat panel detector | |
| Motion mechanism | X/Y operation control mode | Dual drive linear motor + grating ruler position feedback |
| abutment | marble | |
| Track width adjustment method | auto-adjust | |
| Incoming board flow direction | Left to right or right to left (factory setting) | |
| Splint method | Automatic splint | |
| Hardware Configuration | operating system | Win10 |
| way of communication | Ethernet, SMEMA | |
| power supply | Single phase 220V, 50/60Hz, 5A | |
| air pressure | 0.4-0.6MPa | |
| Orbital height | 900*25mm | |
| Machine size | L1730*D1830*H2000mm (excluding lamp) | |
| weight | 3000kg | |
| radiation safety | Radiation leakage <0.5μSv/h | |
| Check PCB specifications | size | 50*50-510*610mm |
| Warp | +3mm (equipped with laser displacement meter for plate bending compensation) | |
| Board weight | s7kg | |
| craft edge | 3.0mm | |
| Check item | Detection element | BGA/LGA/CSP, SOP/QFP/QFN, transistors, R/C chips, bottom electrode components, power modules, POP, connectors, THT insertion components, semiconductor IGBT soldering layers |
| Check for defects | Bubbles, open soldering, no wetting, solder volume, offset, bridging, solder creep, through-hole solder filling, solder beads, etc. | |
| Check ability | Maximum number of slice layers | 300 floors |
| Fastest checking speed | 3s/FOV. | |
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