“Panasonic’s next-generation manufacturing concept “Smart Manufacturing”
Automation and labor saving in the assembly workshop, improving production line productivity and quality and reducing costs
1. No manual operation required
M2M autonomous production line evolution
APC system, automatic recovery option
2. Requires manual judgment
Centralized control
Workshop management system, remote operation option
3. Manual operation is required to control uneven operation.
Navigation, automation small products
Feeder preparation navigation, component supply and junction navigation, automated small products
Feature | Maintain high-quality, high-capacity unmanned workshops | ||
Equipment introduction (main functions and features) | “Panasonic’s next-generation manufacturing concept “Smart Manufacturing” Automation and labor saving in the assembly workshop, improving production line productivity and quality and reducing costs 1. No manual operation required 2. Requires manual judgment 3. Manual operation is required to control uneven operation. A new platform to realize “intelligent manufacturing” |
||
Substrate size | Monorail L 50 mm×W 50 mm~L 510 mm×W 590 mm | ||
Double track L 50 mm×W 50 mm~L 510 mm×W 300 mm | |||
Substrate replacement time | “2.1 s(below L275m) 4.8s (exceeding L275m ~ below L460m) *The situation may vary depending on the specifications of the substrate.” |
||
power supply | 三相 AC 200,220,380,400,420,480 V 5.0 KVA | ||
Air pressure source | Min.0.5 MPa、200L/min(A.N.R.) | ||
Equipment size | W1665 mm xD2570 mm·2 xH1 444 mm *3 | ||
weight | 3 600kg (main body only: Varies depending on the configuration of optional parts. | ||
Placement head | Lightweight 16-nozzle placement head V2 (when equipped with 4 placement heads) | Lightweight 8-nozzle placement head (when equipped with 4 placement heads) | |
Placement speed | Fastest speed | 184 800 cph (0.0195 s/square chip) | 96 000 cph(0.0375 s/方square chip) |
IPC9850 (1608) |
130 000 cph *4 | ———————— | |
Mounting accuracy (CPK≥1) | ±25 um/square chip | ±25um/square chip ±40 um/QFP □12 m or less ±25 um/QFP □12m~□32 m |
|
Component size (MM) | 0201 component*5*6/03015 component*5 0402 component*5~L6xW6xT3 |
“0402 component*5~L45xW45 or L100xW40xT12” |
|
Component supply | Braid | Braiding width: 4*7/8/12/16/24/32/44/56mm | |
4*7, 8mm tape: Max.136 | |||
Rod-shaped | Max.16 Company | ||
*Values such as placement speed and accuracy may vary depending on conditions. *Please refer to the “Specifications” for details. *1: Only the subject |