SMT Reflow Oven

The Reflow Oven is a critical component of the SMT production line. It is primarily used for the soldering process after component placement. In SMT production, components are placed on the PCB with solder paste and soldered using reflow equipment.

Basic Working Principle:

1. Preheat Zone:The PCB enters the preheat zone to activate the flux, remove moisture, and gradually heat the solder paste to avoid thermal shock.
2. Thermal Zone:The PCB enters the thermal zone, where hot air melts the solder paste.
3. Cooling Zone:Finally, the PCB moves to the cooling zone, where the solder solidifies, forming stable solder joints.
4. Nitrogen Protection:Modern reflow soldering equipment often uses nitrogen or other inert gases to prevent oxidation during soldering.
5. Quality Inspection:Post-soldering, automatic optical inspection (AOI), or other methods check the solder quality.

Types of Reflow Ovens:

• Hot Air Reflow Soldering:This is the most traditional method of using hot air as the heating medium.
• Infrared (IR) Reflow Soldering:Uses infrared radiation for rapid heating but may cause uneven heat distribution.
• Vapor Phase Reflow Soldering:This method uses vapour as the heating medium, providing uniform heating but at a higher equipment cost.

Reflow soldering equipment enhances production efficiency, ensures soldering quality, reduces costs, and meets environmental standards.