Electronics Industry
Advanced Electronic PCB Assembly SMT Solutions for Computers and Mobile Phones
Computers and mobile phones are the most common electronic products in our daily lives. They all use modern electronic technology and communication technology to provide people with great convenience and entertainment.
A computer consists of a central processing unit, memory, hard disk, graphics card, motherboard, power supply, etc., and is used to calculate, store, process and display various information.
A mobile phone is a portable communication terminal, consisting of a processor, memory, screen, camera, battery, etc.
SMT technology is one of the most commonly used production technologies in the electronics manufacturing industry and is widely used in the production of mobile phones and computer PCB boards.
For PCB boards, SMT technology can realize high-precision automatic placement and rapid reflow soldering of electronic components, effectively improving production efficiency and quality. At the same time, SMT technology can also achieve miniaturization and lightweight of circuit boards, making mobile phones and computers more portable and easier to use.
The production and manufacturing of these products are inseparable from SMT and DIP production processes.
SMT (Surface Mount Technology) and DIP (Dual In-line Package) are two different processes used in computer and mobile phone PCB assembly.
The SMT process is mainly used to mount surface mount components (such as chips, capacitors, inductors, etc.), and the DIP process is mainly used to mount dual in-line package components (such as sockets, switches, etc.).
SMT and DIP processes have their own advantages and scope of application in computer and mobile phone PCB assembly processes, and should be selected and applied according to actual conditions.
For more details on SMT solutions for advanced electronics PCB assembly for computers and mobile phones, please contact us for free.
If you are a factory that produces computers and mobile phones, please contact us for PCB assembly SMT and DIP solutions.
SMT case is for reference only
Computers and mobile phones are typically industries with large volumes and the highest degree of standardization.
Therefore, the key equipment is the placement machine. The modular placement machine has the advantages of high
precision and large production capacity, and is the first choice for selection.
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吸送一体机配静电除尘系统 |
NXT 8MM FEEDER |
V12 0.7 NOZZLE |
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印刷机MPM BTB MOMENTUM |
NXT12MM FEEDER |
V12 1.8 NOZZLE |
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单轨接驳台 50CM 标准型 |
NXT 16MM FEEDER |
H04SF 1.8 NOZZLE |
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双轨平移机 280CM |
NXT 24MM FEEDER |
H04SF 2.5 NOZZLE |
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双轨SPI KY-8030-II |
NXT 32MM FEEDER |
H04SF 3.7 NOZZLE |
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双轨缓存机 120CM |
NXT 44MM FEEDER |
H02F 3.7G NOZZLE |
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双轨贴片机 NXT M3III |
NXT 56MM FEEDER |
H04SF 5.0G NOZZLE |
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双轨贴片机 NXT M6III |
NXT 72MM FEEDER |
H02F 3.7G NOZZLE |
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双轨贴片机 NXT M6III 配LTC-TRAY |
工作头H24S |
H02F 5.0G NOZZLE |
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双轨接驳台 50cm |
工作头V12 |
H02F 7.0G NOZZLE |
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双轨炉前AOI LI-3000DP |
工作头H08 |
H02F 10.0GNOZZLE |
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双轨缓存机 120CM |
工作头H04SF |
H02F 15.0G NOZZLE |
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双轨贴片机 NXT M6III |
工作头H02F |
H04SF 5.0G NOZZLE |
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双轨贴片机 NXT M6III配LT-TRAY |
H24S S 型NOZZLE |
H04SF 5.0G NOZZLE |
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双轨接驳台 50cm |
H24S M 型NOZZLE |
H02F 3.7G NOZZLE |
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双轨回流炉1936MARK5 10温区氮气炉无铅 |
H24S 1.3 型NOZZLE |
V12 0.7 NOZZLE |
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双轨接驳台 100cm 双段 |
H24S 1.8 型NOZZLE |
V12 1.8 NOZZLE |
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双轨炉后AOI LI3000DP |
V12 1.0 NOZZLE |
H04SF 1.8 NOZZLE |
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双轨接驳台 50cm |
V12 1.3 NOZZLE |
H04SF 2.5 NOZZLE |
| H04SF 3.7 NOZZLE |
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